PCB Calculator

Trace width, current capacity, impedance and via sizing.

🔌 PCB Trace CalculatorCalculate trace impedance, current capacity (IPC-2221), and via requirements
Trace ParametersTrace Type
Trace Width (mm)
Trace Length (mm)
Copper Weight
Current (A)
Allowed Temp Rise (°C)
Impedance ParametersPCB Material
Dielectric Height (H) (mm)
Target Impedance (Ω)
Frequency (GHz)
Via ParametersVia Diameter (mm)
Plating Thickness (µm)
Current Capacity (IPC-2221)External Layer Capacity
0.875A
Internal Layer Capacity
0.438A
Required Width (Ext)
0.781mm
Required Width (Int)
2.033mm
Trace Resistance
104.322mΩ
Voltage Drop
208.643mV
Power Loss
417.287mW
Copper Thickness
35.000µm
Impedance AnalysisCalculated Z₀
42.934Ω
Effective εᵣ
3.469
Width for 50Ω
0.142mm
Dielectric (εᵣ)
4.500
Loss Tangent
0.020
Tg
130.000°C
Signal PropagationVelocity
160.956Mm/s
Wavelength (λ)
160.956mm
Prop. Delay
6.21e+3ps/mm
Trace Delay
3.11e+5ps
Via AnalysisVia Current Capacity
1.685A
Vias Needed
2.000
Via Diameter
0.300mm
Plating
25.000µm
Impedance vs Widthmicrostrip with H=0.2mm, εᵣ=4.5
Current Capacity vs Width1 oz (35 µm), ΔT=10°C
Design Guidelines• IPC-2221: External layers have ~2× current capacity of internal layers due to better cooling.
• Impedance Control: Standard tolerances are ±10% for most PCB fabs; specify ±5% for critical RF.
• Trace Length: Keep high-speed traces <λ/10 to avoid transmission line effects.
• Via Count: For high current, use multiple vias in parallel; space them > 3× diameter apart.
• Material Selection: Use low-loss materials (Rogers, Isola) for RF > 1GHz or high-speed digital.
• Return Path: Always ensure solid ground plane under controlled impedance traces.

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🔌 PCB Trace CalculatorCalculate trace impedance, current capacity (IPC-2221), and via requirements
Trace ParametersTrace Type
Trace Width (mm)
Trace Length (mm)
Copper Weight
Current (A)
Allowed Temp Rise (°C)
Impedance ParametersPCB Material
Dielectric Height (H) (mm)
Target Impedance (Ω)
Frequency (GHz)
Via ParametersVia Diameter (mm)
Plating Thickness (µm)
Current Capacity (IPC-2221)External Layer Capacity
0.875A
Internal Layer Capacity
0.438A
Required Width (Ext)
0.781mm
Required Width (Int)
2.033mm
Trace Resistance
104.322mΩ
Voltage Drop
208.643mV
Power Loss
417.287mW
Copper Thickness
35.000µm
Impedance AnalysisCalculated Z₀
42.934Ω
Effective εᵣ
3.469
Width for 50Ω
0.142mm
Dielectric (εᵣ)
4.500
Loss Tangent
0.020
Tg
130.000°C
Signal PropagationVelocity
160.956Mm/s
Wavelength (λ)
160.956mm
Prop. Delay
6.21e+3ps/mm
Trace Delay
3.11e+5ps
Via AnalysisVia Current Capacity
1.685A
Vias Needed
2.000
Via Diameter
0.300mm
Plating
25.000µm
Impedance vs Widthmicrostrip with H=0.2mm, εᵣ=4.5
Current Capacity vs Width1 oz (35 µm), ΔT=10°C
Design Guidelines• IPC-2221: External layers have ~2× current capacity of internal layers due to better cooling.
• Impedance Control: Standard tolerances are ±10% for most PCB fabs; specify ±5% for critical RF.
• Trace Length: Keep high-speed traces <λ/10 to avoid transmission line effects.
• Via Count: For high current, use multiple vias in parallel; space them > 3× diameter apart.
• Material Selection: Use low-loss materials (Rogers, Isola) for RF > 1GHz or high-speed digital.
• Return Path: Always ensure solid ground plane under controlled impedance traces.