Thermal Designer

Junction temperature, heatsink sizing and airflow.

Thermal Management Designer

Heat sink sizing, fin optimization, and thermal resistance analysis

Thermal Requirements

Power Dissipation

Ambient Temperature

°C

Max Junction Temp

°C

Heat Sink

Material

Fin Type

Base Width

Base Length

Base Thickness

Fin Height

Fin Thickness

Fin Count

Thermal Interface

TIM Material

TIM Thickness

Source Width

Source Length

Cooling

Cooling Method

Air Velocity

m/s

Thermal Performance

Junction Temp

59.8 °C

Heat Sink Temp

51.5 °C

Thermal Margin

40.2 °C

Total R_th

0.529 K/W

Max Power Capacity

141.7 W

Fin Efficiency

93.6 %

Heat Sink Mass

248 g

h (Conv Coeff)

50.0 W/m²K

Thermal Resistance Breakdown

Power vs Temperature Rise

Temperature Distribution

Design Summary & Recommendations

Heat Sink Geometry

Surface Area: 789 cm²

Fin Spacing: 2.6 mm

Aspect Ratio: 9.5

Pressure Drop: 5.1 Pa

Resistance Values

R_TIM: 166.67 mK/W

R_Spreading: 105.26 mK/W

R_Base: 3.89 mK/W

R_Conv: 253.50 mK/W

Design Checks

✓ Good thermal margin (>10°C)

✓ Good fin efficiency (>70%)

✓ Adequate fin spacing

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